| Topic |
Sub-topic |
| Chapter 1: Introduction (1h) |
Course introduction. Objectives and course planning. Basic concepts of microelectronic design of integrated circuits (ICs). |
| Chapter 2: Manufacturing sequence for ICs (1h) |
Introduction to ICs manufacturing. Planar technology. Manufacturing sequence of ICs in CMOS technology. Structure of MOS transistors. Manufacturing example: CMOS inverter. Masks pattern (layout). Technological design rules. Methodologies and tools for design assistance. |
| Chapter 3: Physical structure of basic devices and routing strategies (1h) |
Specification of the physical structure of MOS transistor. Specification of the physical structure of a resistor. Specification of the physical structure of a capacitor. Strategies for performing transistors with high aspect ratio. Strategies for matched transistors. |
| Chapter 4: Basic amplifier topologies (2h) |
Common source topology. Common drain topology. Common gate topology. Cascode topology. Push_Pull amplifier. Physical design examples. |
| Chapter 5: Current mirror (3h) |
Current sources. Basic structure of a current mirror. Analysis of functioning. Frequency response. Cascode topology. Physical design examples. |
| Chapter 6: Differential pair (3h) |
Differential pair structure. DC analysis. AC analysis. Specifications and design of the physical structure of a self-biased differential amplifier topology. Common mode rejection ratio. Matching of transistors. Slew rate limitations. Physical design examples. |
| Chapter 7: Operational amplifier (2h) |
Two stages operational amplifier. Design parameters. Operational Transconductance Amplifier (OTA). Examples of physical designs. |
| Chapter 8: Preparing for manufacturing (2h) |
Distribution in the base plane. Pad and terminals. Specification formats. Packages.
|
| Laboratory session 1: Introduction to design tools for ICs (2h) |
Introduction to design tools for analog ICs. Current mirror example. Electric simulation. Design Rules Check (DRC) and layout extraction. |
| Laboratory session 2: Design of self-biased differential pair (2h) |
Electrical specification. Characterization of DC operating parameters. Characterization of AC operating parameters. |
| Laboratory session 3: Design of self-biased differential pair II (2h) |
DRC and layout extraction. Layout versus schematic (LVS). Post-layout simulation. |
| Laboratory session 4: Design of a transconductance amplifier (2h) |
Electrical Specification. Physical specification. Operation testing. |
| Laboratory session 5: Preparing for manufacturing (2h) |
For the circuit obtained in Laboratory session 4, perform the required steps to create the information needed in order to send the circuit to manufacture. |
